Invention Grant
- Patent Title: Semiconductor memory devices including an air gap and methods of fabricating the same
- Patent Title (中): 包括气隙的半导体存储器件及其制造方法
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Application No.: US14096195Application Date: 2013-12-04
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Publication No.: US09166012B2Publication Date: 2015-10-20
- Inventor: Jae-Hwang Sim , Jinhyun Shin , Jong-Min Lee
- Applicant: Jae-Hwang Sim , Jinhyun Shin , Jong-Min Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2012-0139774 20121204
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L29/423 ; H01L21/764 ; H01L27/115

Abstract:
Provided are a semiconductor memory device and a method of fabricating the same, the semiconductor memory device may include a semiconductor substrate with a first trench defining active regions in a first region and a second trench provided in a second region around the first region, a gate electrode provided on the first region to cross the active regions, a charge storing pattern disposed between the gate electrode and the active regions, a blocking insulating layer provided between the gate electrode and the charge storing pattern and extending over the first trench to define a first air gap in the first trench, and an insulating pattern provided spaced apart from a bottom surface of the second trench to define a second air gap in the second trench.
Public/Granted literature
- US20140151777A1 Semiconductor Memory Devices and Methods of Fabricating the Same Public/Granted day:2014-06-05
Information query
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