Invention Grant
- Patent Title: High-frequency circuit module
- Patent Title (中): 高频电路模块
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Application No.: US13963775Application Date: 2013-08-09
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Publication No.: US09166765B2Publication Date: 2015-10-20
- Inventor: Hiroshi Nakamura , Tomohiro Igarashi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2012-182286 20120821
- Main IPC: H04B1/50
- IPC: H04B1/50 ; H03H7/46 ; H04L5/14 ; H01L23/373 ; H05K1/02 ; H04B1/00 ; H03H9/05 ; H03H9/08
Abstract:
Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC.
Public/Granted literature
- US20140056183A1 HIGH-FREQUENCY CIRCUIT MODULE Public/Granted day:2014-02-27
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