Invention Grant
US09170207B2 3D inspection using cameras and projectors with multiple-line patterns
有权
使用具有多行图案的相机和投影机进行3D检查
- Patent Title: 3D inspection using cameras and projectors with multiple-line patterns
- Patent Title (中): 使用具有多行图案的相机和投影机进行3D检查
-
Application No.: US13190195Application Date: 2011-07-25
-
Publication No.: US09170207B2Publication Date: 2015-10-27
- Inventor: Mathieu Perriollat
- Applicant: Mathieu Perriollat
- Applicant Address: FR Saint Egreve
- Assignee: VIT
- Current Assignee: VIT
- Current Assignee Address: FR Saint Egreve
- Agency: Vedder Price, P.C.
- Priority: FR1056086 20100726
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G01N21/88 ; G01B11/25 ; G01N21/956 ; G06T1/00 ; G01R31/308

Abstract:
An installation of optical inspection of integrated circuits or the like includes a photographic system placed above a scene in a plane defined by a first and a second direction, the photographic system having several digital cameras each having an orthogonal array of pixels, all cameras having their respective optical axes inclined by a first angle with respect to a third direction perpendicular to the two others; and two projectors of determined patterns, these patterns being such that two straight lines projected by each of the projectors are aligned in the plane defined by the first two directions and are coplanar with a straight line interconnecting the optical centers of the two projectors.
Public/Granted literature
- US20120019651A1 INSTALLATION OF 3D INSPECTION OF ELECTRONIC CIRCUITS Public/Granted day:2012-01-26
Information query