An electrical connection system for an optoelectronic socket comprises an optoelectronic socket (1), an OE package (2) assembled to the optoelectronic socket (1), and a circuit board (4). The optoelectronic socket (1) comprises a plurality of passageways (104) embedded with an optical member (12) respectively, and a number of electrical contacts. The OE package (2) comprises a plurality of lenses (20) located at bottom portion thereof and a plurality of electrical pads (22) located at peripheral of the bottom portion. Bottom end of the lens (20) of the OE package (2) are received in the passageway (104) and the electrical pads (22) contact with the electrical contacts (14). The optical member (12) is received in recess on upper face of the circuit board (4) and connects with a waveguide (40) positioned in the recess. The electrical contact is soldered to the circuit board.