Invention Grant
- Patent Title: Method for fabricating an electronic component
- Patent Title (中): 电子部件的制造方法
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Application No.: US13681079Application Date: 2012-11-19
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Publication No.: US09171804B2Publication Date: 2015-10-27
- Inventor: Georg Meyer-Berg , Khalil Hosseini , Joachim Mahler , Edward Fuergut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L21/78 ; H01L23/538 ; H01L23/00 ; H01L23/495 ; H01L21/56
Abstract:
A carrier and a semiconductor chip are provided. A connection layer is applied to a first main face of the semiconductor chip. The connection layer includes a plurality of depressions. A filler is applied to the connection layer or to the carrier. The semiconductor chip is attached to the carrier so that the connection layer is disposed between the semiconductor chip and the carrier. The semiconductor chip is affixed to the carrier.
Public/Granted literature
- US20140138843A1 Method for Fabricating an Electronic Component Public/Granted day:2014-05-22
Information query
IPC分类:
