Invention Grant
- Patent Title: Semiconductor structure having aperture antenna
- Patent Title (中): 具有孔径天线的半导体结构
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Application No.: US13834424Application Date: 2013-03-15
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Publication No.: US09172131B2Publication Date: 2015-10-27
- Inventor: Chi-Han Chen , Chi-Tsung Chiu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Klein, O'Neill & Singh, LLP
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/22 ; H01Q9/04 ; H01Q21/00 ; H01Q21/06
Abstract:
The semiconductor package includes a first substrate having a first surface and a second surface opposite to the first surface. A circuit portion is formed on the first surface of the substrate, wherein the circuit portion includes a wave guiding slot and a microstrip line overlapping the wave guiding slot. A chip is disposed on the circuit portion. An antenna is formed on the second surface of the substrate, wherein the antenna overlaps the wave guiding slot.
Public/Granted literature
- US20140266947A1 SEMICONDUCTOR STRUCTURE HAVING APERTURE ANTENNA Public/Granted day:2014-09-18
Information query
