Invention Grant
- Patent Title: Flexible circuit board with planarized cover layer structure
- Patent Title (中): 柔性电路板,平面化覆盖层结构
-
Application No.: US14068029Application Date: 2013-10-31
-
Publication No.: US09173284B2Publication Date: 2015-10-27
- Inventor: Kuo-Fu Su , Gwun-Jin Lin
- Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- Applicant Address: TW Taoyuan County
- Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW102126779A 20130726
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H01B7/08 ; H05K3/28

Abstract:
A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.
Public/Granted literature
- US20150027751A1 FLEXIBLE CIRCUIT BOARD WITH PLANARIZED COVER LAYER STRUCTURE Public/Granted day:2015-01-29
Information query