Invention Grant
US09173298B2 Packaging substrate, method for manufacturing same, and chip packaging structure having same
有权
包装基板，其制造方法以及具有该基板的芯片封装结构
- Patent Title: Packaging substrate, method for manufacturing same, and chip packaging structure having same
- Patent Title (中): 包装基板，其制造方法以及具有该基板的芯片封装结构
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Application No.: US14097251Application Date: 2013-12-05
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Publication No.: US09173298B2Publication Date: 2015-10-27
- Inventor: Yong Ha Woo , E-Tung Chou , Wen-Lun Lo
- Applicant: Zhen Ding Technology Co., Ltd.
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN2012105822446 20121228
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/44 ; H05K3/00 ; H01L23/498 ; H01L25/10 ; H05K3/34 ; H05K3/40
Abstract:
A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.
Public/Granted literature
- US20140185259A1 PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME Public/Granted day:2014-07-03
Information query
IPC分类:
