Invention Grant
- Patent Title: Electrospun patterned stent graft covering
- Patent Title (中): 电纺图案支架移植覆盖物
-
Application No.: US13295589Application Date: 2011-11-14
-
Publication No.: US09175427B2Publication Date: 2015-11-03
- Inventor: Kenneth A. Haselby , Keith R. Milner , Sara M. Sherman , Seoggwan Kim , Richard A. Swift
- Applicant: Kenneth A. Haselby , Keith R. Milner , Sara M. Sherman , Seoggwan Kim , Richard A. Swift
- Applicant Address: US IN Bloomington
- Assignee: Cook Medical Technologies LLC
- Current Assignee: Cook Medical Technologies LLC
- Current Assignee Address: US IN Bloomington
- Agency: Brinks Gilson & Lione
- Main IPC: B32B3/24
- IPC: B32B3/24 ; D04H1/728 ; D01D5/00 ; A61F2/07

Abstract:
An endoluminal prosthesis and systems and methods for making the prosthesis are provided. In one example, a patterned graft material for a prosthesis includes a network of electrospun fibers. The network of electrospun fibers may include a plurality of continuous electrospun fibers. The fibers may be collected on a collector plate using an electrospinning process to form the network of fibers. The patterned graft material also may include a plurality of openings in the network of electrospun fibers. The plurality of openings may be arranged in a pattern. The network of electrospun fibers may include a plurality of edges, each surrounding a corresponding one of the plurality of openings. Each of the plurality of edges may include at least one electrospun fiber of the network of electrospun fibers. A majority of the electrospun fibers of the plurality of edges may be continuous at the edges.
Public/Granted literature
- US20130122248A1 ELECTROSPUN PATTERNED STENT GRAFT COVERING Public/Granted day:2013-05-16
Information query