Invention Grant
- Patent Title: Measuring device housing
- Patent Title (中): 测量装置外壳
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Application No.: US14426734Application Date: 2013-08-14
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Publication No.: US09175988B2Publication Date: 2015-11-03
- Inventor: Joe Kieliger , Martin Lenze
- Applicant: Siemens Aktiengesellschaft
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Beusse Wolter Sanks & Maire
- Priority: DE102012216267 20120913
- International Application: PCT/EP2013/067030 WO 20130814
- International Announcement: WO2014/040817 WO 20140320
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01J5/04 ; G01J5/00 ; G01J5/02 ; G01J5/06 ; G01J5/08

Abstract:
A measuring device housing for a sensor component, which detects a physical parameter without contact is provided, having: a coupling apparatus for supplying at least one flushing medium and at least one signal transmission line in the housing interior, a guide pipe arranged on the coupling apparatus having a longitudinal axis and a probe head fastened on the end section of the guide pipe. The guide pipe is designed to conduct or accommodate the at least one cooling medium and the at least one signal transmission line up to the probe head. The probe head and the end section, relative to the longitudinal axis of the guide pipe or the probe head, each have radially extending passages for conducting the cooling media from the end section into the probe head and the reverse, as applicable.
Public/Granted literature
- US20150241252A1 MEASURING DEVICE HOUSING Public/Granted day:2015-08-27
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