Invention Grant
- Patent Title: Sensor, electronic apparatus, robot, and mobile object
- Patent Title (中): 传感器，电子仪器，机器人和移动物体
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Application No.: US14044992Application Date: 2013-10-03
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Publication No.: US09176013B2Publication Date: 2015-11-03
- Inventor: Shogo Inaba , Kyo Horie
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-226669 20121012
- Main IPC: G01L1/10
- IPC: G01L1/10 ; G01P15/097 ; G01P15/18 ; G01L1/14 ; H03H9/24
Abstract:
A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.
Public/Granted literature
- US20140102217A1 SENSOR, ELECTRONIC APPARATUS, ROBOT, AND MOBILE OBJECT Public/Granted day:2014-04-17
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