Invention Grant
- Patent Title: Chip mounting
- Patent Title (中): 芯片安装
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Application No.: US12518262Application Date: 2007-11-26
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Publication No.: US09177885B2Publication Date: 2015-11-03
- Inventor: Simon Jonathan Stacey
- Applicant: Simon Jonathan Stacey
- Applicant Address: GB Cambridge
- Assignee: Cambridge Silicon Radio Limited
- Current Assignee: Cambridge Silicon Radio Limited
- Current Assignee Address: GB Cambridge
- Agency: Vorys, Sater, Seymour and Pease LLP
- Agent Vincent M DeLuca
- Priority: GB0624888.4 20061213
- International Application: PCT/GB2007/004500 WO 20071126
- International Announcement: WO2008/071905 WO 20080619
- Main IPC: H01L23/32
- IPC: H01L23/32 ; H01L23/31 ; H01L23/28 ; H01L23/532 ; H01L23/29 ; H01L23/00
Abstract:
A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5GPa or less.
Public/Granted literature
- US20100013093A1 Chip Mounting Public/Granted day:2010-01-21
Information query
IPC分类:
