Invention Grant
- Patent Title: Semiconductor package and method for fabricating base for semiconductor package
- Patent Title (中): 半导体封装用半导体封装及其制造方法
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Application No.: US13721983Application Date: 2012-12-20
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Publication No.: US09177899B2Publication Date: 2015-11-03
- Inventor: Tzu-Hung Lin , Wen-Sung Hsu , Ta-Jen Yu , Andrew C. Chang
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/77 ; H01L23/495 ; H01L23/498 ; H01L23/00 ; H01L49/02
Abstract:
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
Public/Granted literature
- US20140035095A1 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE Public/Granted day:2014-02-06
Information query
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