Invention Grant
- Patent Title: RF switch on high resistive substrate
- Patent Title (中): 射频开关在高电阻衬底上
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Application No.: US13866886Application Date: 2013-04-19
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Publication No.: US09178058B2Publication Date: 2015-11-03
- Inventor: Chia-Chung Chen , Chi-Feng Huang , Shu Fang Fu , Tzu-Jin Yeh , Chewn-Pu Jou
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336 ; H01L21/98 ; H01L29/417 ; H01L29/66 ; H01L21/761 ; H01L29/10 ; H01L21/762

Abstract:
A device includes a semiconductor substrate of a first conductivity type, and a deep well region in the semiconductor substrate, wherein the deep well region is of a second conductivity type opposite to the first conductivity type. The device further includes a well region of the first conductivity type over the deep well region. The semiconductor substrate has a top portion overlying the well region, and a bottom portion underlying the deep well region, wherein the top portion and the bottom portion are of the first conductivity type, and have a high resistivity. A gate dielectric is over the semiconductor substrate. A gate electrode is over the gate dielectric. A source region and a drain region extend into the top portion of the semiconductor substrate. The source region, the drain region, the gate dielectric, and the gate electrode form a Radio Frequency (RF) switch.
Public/Granted literature
- US20140264635A1 RF Switch on High Resistive Substrate Public/Granted day:2014-09-18
Information query
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