发明授权
- 专利标题： Flat heat pipe and fabrication method thereof
- 专利标题（中）： 扁平热管及其制造方法
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申请号： US13572176申请日： 2012-08-10
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公开(公告)号： US09179577B2公开(公告)日： 2015-11-03
- 发明人: Seok Hwan Moon
- 申请人： Seok Hwan Moon
- 申请人地址： KR Daejeon
- 专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址： KR Daejeon
- 代理机构： Rabin & Berdo, P.C.
- 优先权： KR10-2011-0116034 20111108
- 主分类号： F28D15/04
- IPC分类号： F28D15/04 ; H05K7/20 ; F28F1/20 ; H01L23/427
摘要：
Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.
公开/授权文献
- US20130112372A1 FLAT HEAT PIPE AND FABRICATION METHOD THEREOF 公开/授权日：2013-05-09
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