Invention Grant
- Patent Title: Rotational-flow spray nozzle and process of using same
- Patent Title (中): 旋转喷嘴及其使用过程
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Application No.: US13540552Application Date: 2012-07-02
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Publication No.: US09180541B2Publication Date: 2015-11-10
- Inventor: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
- Applicant: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Knoard Raynes Davda & Victor LLP
- Agent Alan S. Raynes
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K3/08 ; B05B7/08 ; B05B15/04 ; B05B5/03 ; B05B15/06 ; B23K35/02 ; B05C5/02 ; B05B5/04
Abstract:
A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Public/Granted literature
- US20120266972A1 ROTATIONAL-FLOW SPRAY NOZZLE AND PROCESS OF USING SAME Public/Granted day:2012-10-25
Information query
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