公开(公告)号：US09180541B2

公开(公告)日：2015-11-10

申请号：US13540552

申请日：2012-07-02

Applicant: Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

Inventor： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

IPC: B23K1/00 ,  B23K3/08 ,  B05B7/08 ,  B05B15/04 ,  B05B5/03 ,  B05B15/06 ,  B23K35/02 ,  B05C5/02 ,  B05B5/04

CPC classification number: B23K3/082 ,  B05B5/032 ,  B05B5/0403 ,  B05B7/0861 ,  B05B12/36 ,  B05B14/30 ,  B05B15/65 ,  B05C5/02 ,  B23K35/0244 ,  Y10T137/2931

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。

公开(公告)号：US20070212868A1

公开(公告)日：2007-09-13

申请号：US11394853

申请日：2006-03-13

Applicant: Shubhada Sahasrabudhe ,  Nitin Deshpande

Inventor： Shubhada Sahasrabudhe ,  Nitin Deshpande

IPC: H01L21/44

CPC classification number: H01L23/3157 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

Abstract: A method, system, and apparatus, the apparatus including a metal layer on silicon, photo-resist material disposed on the metal layer, a bump pad reservoir adjacent to the metal layer, a quantity of interconnect metal disposed in the bump pad reservoir, and a resist opening in resist material disposed on a surface of the bump metal and adjacent the interconnect metal. The resist opening may be wider at an open end thereof than at an end in contact with the interconnect metal.

Abstract translation: 一种方法，系统和装置，所述装置包括硅上的金属层，设置在金属层上的光致抗蚀剂材料，与金属层相邻的凸块焊盘储存器，设置在凸块焊盘储存器中的一定数量的互连金属，以及 抗蚀剂材料中的抗蚀剂开口，设置在凸块金属的表面上且与互连金属相邻。 抗蚀剂开口在其开口端可比在与互连金属接触的端部更宽。

公开(公告)号：US20070138621A1

公开(公告)日：2007-06-21

申请号：US11305527

申请日：2005-12-16

Applicant: Sandeep Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

Inventor： Sandeep Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

IPC: H01L23/12

CPC classification number: H01L23/4275 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433

Abstract: A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

公开(公告)号：US20150187681A1

公开(公告)日：2015-07-02

申请号：US14141123

申请日：2013-12-26

Applicant: Ravi V. Mahajan ,  Nitin Deshpande ,  John S. Guzek ,  Adel Elsherbini

Inventor： Ravi V. Mahajan ,  Nitin Deshpande ,  John S. Guzek ,  Adel Elsherbini

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16105 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/75251 ,  H01L2224/75253 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/113 ,  H05K1/116 ,  H05K3/3436 ,  H05K3/3494 ,  H01L2924/00014 ,  H01L2924/014

Abstract: This disclosure relates generally to a system and method including a substrate and an electronic component. The substrate includes a circuit board including a hole, a routing layer, and a first interconnect portion positioned, at least in part, within the hole. The electronic component includes a second interconnect portion, coupled to the first interconnect portion, forming an interconnect between the electronic component and the routing layer.

Abstract translation: 本公开一般涉及包括基板和电子部件的系统和方法。 基板包括电路板，该电路板包括孔，布线层和至少部分地定位在孔内的第一互连部分。 电子部件包括耦合到第一互连部分的第二互连部分，在电子部件和布线层之间形成互连。

公开(公告)号：US20120266972A1

公开(公告)日：2012-10-25

申请号：US13540552

申请日：2012-07-02

Applicant: Harikrishnan RAMANAN ,  Nitin DESHPANDE ,  Sabina J. HOULE

Inventor： Harikrishnan RAMANAN ,  Nitin DESHPANDE ,  Sabina J. HOULE

IPC: B67D7/06

CPC classification number: B23K3/082 ,  B05B5/032 ,  B05B5/0403 ,  B05B7/0861 ,  B05B12/36 ,  B05B14/30 ,  B05B15/65 ,  B05C5/02 ,  B23K35/0244 ,  Y10T137/2931

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。

公开(公告)号：US08215536B2

公开(公告)日：2012-07-10

申请号：US11613490

申请日：2006-12-20

Applicant: Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

Inventor： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

IPC: B23K1/20

CPC classification number: B23K3/082 ,  B05B5/032 ,  B05B5/0403 ,  B05B7/0861 ,  B05B12/36 ,  B05B14/30 ,  B05B15/65 ,  B05C5/02 ,  B23K35/0244 ,  Y10T137/2931

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。

公开(公告)号：US07644871B2

公开(公告)日：2010-01-12

申请号：US11648119

申请日：2006-12-29

Applicant: Harikrishnan Ramanan ,  Sabina Houle ,  Nitin Deshpande ,  Michael Colella ,  Nagaratnam Murugaiah

Inventor： Harikrishnan Ramanan ,  Sabina Houle ,  Nitin Deshpande ,  Michael Colella ,  Nagaratnam Murugaiah

IPC: A62C5/02

CPC classification number: H05K3/0091 ,  H01L21/67126 ,  H01L21/6715 ,  H05K3/3489 ,  H05K2203/1366

Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.

Abstract translation: 描述了改善焊剂喷雾雾化和/或飞溅控制的方法和装置。 在一个实施例中，磁通喷嘴包括多个喷射孔，以将通过空气帽的出口的磁通流体沉积到基板（例如印刷电路板）上。 在沉积到衬底上之前，焊剂流体可以雾化，作为可以有助于减少喷雾飞溅的相对较小的分解通量液滴。 还描述了其它实施例。

公开(公告)号：US20060199299A1

公开(公告)日：2006-09-07

申请号：US11072112

申请日：2005-03-03

Applicant: Nitin Deshpande ,  Sandeep Sane

Inventor： Nitin Deshpande ,  Sandeep Sane

IPC: H01L21/00

CPC classification number: H01L21/4882 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method and apparatus for mounting semiconductor die and integral heat spreader are disclosed. In one embodiment, thermal expansion of the integral heat spreader is restricted by physical constraints during the process of heating interface material that bonds the integral heat spreader and semiconductor die together. In an alternative embodiment, thermal expansion of the integral hat spreader is restricted by applying an external compressive force to the integral heat spreader while heating interface material that bonds the integral heat spreader and semiconductor die together.

Abstract translation: 公开了一种用于安装半导体管芯和整体散热器的方法和装置。 在一个实施例中，整体散热器的热膨胀在加热将整体式散热器和半导体管芯结合在一起的界面材料的加工过程中受到物理限制。 在替代实施例中，通过对整体散热器施加外部压缩力同时加热将整体散热器和半导体管芯结合在一起的界面材料加热来限制整体帽扩展器的热膨胀。

公开(公告)号：US20140357020A1

公开(公告)日：2014-12-04

申请号：US13908016

申请日：2013-06-03

Applicant: Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Omkar Karhade ,  Nitin Deshpande

Inventor： Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Omkar Karhade ,  Nitin Deshpande

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67709 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/15 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2224/04105 ,  H01L2224/2101 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/8312 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The subject matter of the present description relates to methods for the precise integration of microelectronic dice within a multichip package which substantially reduce or eliminate any misalign caused by the movement of the microelectronic dice during the integration process. These methods may include the use of a temporary adhesive in conjunction with a carrier having at least one recess for microelectronic die alignment, the use of a precision molded carrier for microelectronic die alignment, the use of magnetic alignment of microelectronic dice on a reusable carrier, and/or the use of a temporary adhesive with molding processes on a reusable carrier.

Abstract translation: 本说明书的主题涉及用于在多芯片封装内精确地集成微电子管芯的方法，其基本上减少或消除了在整合过程期间由微电子管芯的移动引起的任何不对准。 这些方法可以包括使用临时粘合剂与具有用于微电子管芯对准的至少一个凹部的载体的使用，使用用于微电子管芯对准的精密模制载体，在可重复使用的载体上使用微电子骰子的磁对准， 和/或在可重复使用的载体上使用具有模制工艺的临时粘合剂。

公开(公告)号：US07312527B2

公开(公告)日：2007-12-25

申请号：US11305527

申请日：2005-12-16

Applicant: Sandeep B. Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

Inventor： Sandeep B. Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

IPC: H01L23/34

CPC classification number: H01L23/4275 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433

Abstract: A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

Abstract translation: 一种具有半导体封装的方法，装置和系统，包括封闭一定体积的热界面材料的热界面材料坝。