Invention Grant
- Patent Title: Electronic device package and fabrication method thereof
- Patent Title (中): 电子器件封装及其制造方法
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Application No.: US12652715Application Date: 2010-01-05
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Publication No.: US09181084B2Publication Date: 2015-11-10
- Inventor: Chien-Hung Liu
- Applicant: Chien-Hung Liu
- Agency: Liu & Liu
- Main IPC: H01L23/02
- IPC: H01L23/02 ; B81C1/00 ; H01L21/683 ; H01L23/00
Abstract:
The invention provides an electronic device package and fabrication method thereof. The electronic device package includes a sensor chip. An upper surface of the sensor chip comprises a sensing film. A covering plate having an opening structure covers the upper surface of the sensor chip. A cavity is between the covering plate and the sensor chip, corresponding to a position of the sensing film, where the cavity communicates with the opening structure. A spacer is between the covering plate and the sensor chip, surrounding the cavity. A pressure releasing region is between the spacer and the sensing film.
Public/Granted literature
- US20100171189A1 ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2010-07-08
Information query
IPC分类:
