Invention Grant
US09182681B2 Method and system for measuring a stacking overlay error by focusing on one of upper and lower layer overlay marks using a differential interference contrast microscope
有权
使用微分干涉对比显微镜,通过聚焦于上层和下层覆盖标记之一来测量堆叠覆盖误差的方法和系统
- Patent Title: Method and system for measuring a stacking overlay error by focusing on one of upper and lower layer overlay marks using a differential interference contrast microscope
- Patent Title (中): 使用微分干涉对比显微镜,通过聚焦于上层和下层覆盖标记之一来测量堆叠覆盖误差的方法和系统
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Application No.: US13726409Application Date: 2012-12-24
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Publication No.: US09182681B2Publication Date: 2015-11-10
- Inventor: Deh-Ming Shyu , Yi-Sha Ku
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Lin & Associates IP, Inc.
- Priority: TW101140550A 20121101
- Main IPC: G01B9/02
- IPC: G01B9/02 ; G03F7/20

Abstract:
According to one embodiment of a method for measuring a stacking overlay error, the method may use a differential interference contrast microscope system to measure a stacking overlay mark and focus on one overlay mark of a lower layer overlay mark and an upper layer overlay mark when measuring the stacking overlay mark. Then, the method uses an image analysis scheme to obtain an image of the stacking overlay mark from a photo-detector and obtains a first reference position of the lower layer overlay mark in a direction and a second reference position of the upper layer overlay mark in the direction from the image; and computes the stacking overlay error in the direction according to the first and the second reference positions.
Public/Granted literature
- US20140118721A1 METHOD AND SYSTEM FOR MEASURING A STACKING OVERLAY ERROR Public/Granted day:2014-05-01
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