Invention Grant
- Patent Title: Split block semiconductor memory device
- Patent Title (中): 分割块半导体存储器件
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Application No.: US13744965Application Date: 2013-01-18
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Publication No.: US09183934B2Publication Date: 2015-11-10
- Inventor: Masaru Yano
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe P.C.
- Priority: JP2012-098795 20120424
- Main IPC: G11C16/08
- IPC: G11C16/08 ; G11C16/10 ; G11C16/24 ; G11C16/04 ; G11C16/16 ; G11C16/34

Abstract:
A flash memory capable of writing or deleting a split block is provided. A flash memory includes a memory array comprising a plurality of blocks, and a word line selection circuit, wherein each of the plurality of blocks is formed by a plurality of cell units in a well. The cell unit comprises N memory cells, a selection transistor coupled to one terminal of the memory cells, a selection transistor coupled to the other terminal of the memory cells, and a dummy selection transistor coupled between the memory cells. The word line selection circuit splits the block into a first block and a second block to use according to the operation of data writing or data deleting.
Public/Granted literature
- US20140043906A1 SEMICONDUCTOR MEMORY DEVICES Public/Granted day:2014-02-13
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