Invention Grant
- Patent Title: Diffusion barrier coated substrates and methods of making the same
- Patent Title (中): 扩散阻挡涂层基材及其制备方法
-
Application No.: US13873156Application Date: 2013-04-29
-
Publication No.: US09183973B2Publication Date: 2015-11-10
- Inventor: Arvind Kamath , Michael Kocsis , Kevin McCarthy , Gloria Wong , Jiang Li
- Applicant: Arvind Kamath , Michael Kocsis , Kevin McCarthy , Gloria Wong , Jiang Li
- Applicant Address: NO Oslo
- Assignee: Thin Film Electronics ASA
- Current Assignee: Thin Film Electronics ASA
- Current Assignee Address: NO Oslo
- Agency: Central California IP Group, P.C.
- Agent Andrew D. Fortney
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01Q7/00 ; H01L29/786 ; H01L27/12 ; H01Q1/22 ; H01F41/04

Abstract:
Devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The devices include a metal substrate, a diffusion barrier layer on the metal substrate, one or more insulator layers on the diffusion barrier layer, and an antenna and/or inductor on the one or more insulator layer(s). The method includes forming a diffusion barrier layer on the metal substrate, forming one or more insulator layers on the diffusion barrier layer; and forming an antenna and/or inductor on an uppermost one of the insulator layer(s). The antenna and/or inductor is electrically connected to at least one of the diffusion barrier layer and/or the metal substrate. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into device layers formed thereon.
Public/Granted literature
- US20130243940A1 DIFFUSION BARRIER COATED SUBSTRATES AND METHODS OF MAKING THE SAME Public/Granted day:2013-09-19
Information query