Invention Grant
- Patent Title: Chip arrangements and methods for manufacturing a chip arrangement
- Patent Title (中): 用于制造芯片布置的芯片布置和方法
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Application No.: US13678577Application Date: 2012-11-16
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Publication No.: US09184066B2Publication Date: 2015-11-10
- Inventor: Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess , Bernd Roemer , Edward Fuergut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/56 ; H01L23/31 ; H01L23/495 ; H01L23/00
Abstract:
A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads, wherein a first contact pad of the one or more contact pads is electrically contacted to the carrier; a first encapsulation material at least partially surrounding the chip; and a second encapsulation material at least partially surrounding the first encapsulation material.
Public/Granted literature
- US20140138803A1 CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT Public/Granted day:2014-05-22
Information query
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