公开(公告)号：US20210020539A1

公开(公告)日：2021-01-21

申请号：US16929223

申请日：2020-07-15

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Teck Sim Lee ,  Klaus Schiess ,  Xaver Schloegel ,  Lee Shuang Wang ,  Mohd Hasrul Zulkifli

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/31 ,  H01L23/12

摘要： A semiconductor package is disclosed. In one example, the semiconductor package includes a chip carrier, a semiconductor chip attached to the chip carrier, an encapsulation body encapsulating the semiconductor chip, and a mounting hole configured to receive a screw for screw mounting a heatsink onto a first side of the semiconductor package. A second side of the semiconductor package opposite the first side is configured to be surface mounted to an application board.

公开(公告)号：US20190304858A1

公开(公告)日：2019-10-03

申请号：US16365837

申请日：2019-03-27

申请人： Infineon Technologies AG

发明人： Thorsten Scharf ,  Ralf Otremba ,  Thomas Bemmerl ,  Irmgard Escher-Poeppel ,  Martin Gruber ,  Michael Juerss ,  Thorsten Meyer ,  Xaver Schloegel

IPC分类号： H01L23/053 ,  H01L23/40 ,  H01L23/00 ,  H01L23/08

摘要： A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.

公开(公告)号：US09379046B2

公开(公告)日：2016-06-28

申请号：US14752295

申请日：2015-06-26

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/00 ,  B81C1/00

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

公开(公告)号：US09362193B2

公开(公告)日：2016-06-07

申请号：US13742456

申请日：2013-01-16

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Wolfram Hable ,  Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

IPC分类号： H01L23/373 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/06 ,  H01L23/495 ,  H01L23/00

摘要： A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.

公开(公告)号：US09230880B2

公开(公告)日：2016-01-05

申请号：US14165754

申请日：2014-01-28

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Teck Sim Lee ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L23/495 ,  H01L23/40 ,  H01L21/3105 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L23/4006 ,  H01L21/31053 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.

摘要翻译： 电子设备包括半导体芯片，其包括电极，基板元件和将电极连接到基板元件的接触元件。 电子设备还包括密封剂，其被配置为使接触元件至少部分地暴露，使得散热器可以连接到接触元件。

公开(公告)号：US20150294926A1

公开(公告)日：2015-10-15

申请号：US14752295

申请日：2015-06-26

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L23/495 ,  B81C1/00 ,  H01L23/00

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。

公开(公告)号：US09117786B2

公开(公告)日：2015-08-25

申请号：US13693205

申请日：2012-12-04

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L23/12 ,  H01L23/34 ,  H01L21/56 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/00

摘要： The chip module includes a carrier, a semiconductor chip arranged on or embedded inside the carrier, and an insulation layer that at least partly covers a face of the carrier. The dielectric constant ∈r and the thermal conductivity λ of the insulation layer satisfy the condition λ·∈r

摘要翻译： 芯片模块包括载体，布置在载体上或嵌入载体内部的半导体芯片，以及至少部分覆盖载体的表面的绝缘层。 绝缘层的介电常数εr和热导率λ满足条件λ·∈r<4.0 W·m-1·K-1。

公开(公告)号：US20140110829A1

公开(公告)日：2014-04-24

申请号：US14144192

申请日：2013-12-30

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。

公开(公告)号：US10886186B2

公开(公告)日：2021-01-05

申请号：US16365837

申请日：2019-03-27

申请人： Infineon Technologies AG

发明人： Thorsten Scharf ,  Ralf Otremba ,  Thomas Bemmerl ,  Irmgard Escher-Poeppel ,  Martin Gruber ,  Michael Juerss ,  Thorsten Meyer ,  Xaver Schloegel

IPC分类号： H01L23/053 ,  H01L23/08 ,  H01L23/00 ,  H01L23/40

摘要： A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.

公开(公告)号：US09412626B2

公开(公告)日：2016-08-09

申请号：US14935510

申请日：2015-11-09

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess ,  Bernd Roemer ,  Edward Fuergut

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/34 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/552

CPC分类号： H01L21/565 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/495 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/05 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099

摘要： A method for manufacturing a chip arrangement, including disposing a chip over a carrier, wherein the bottom side of the chip is electrically connected to the first carrier side via one or more contact pads on the chip bottom side, disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, and disposing a second encapsulation material over a second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side.

摘要翻译： 一种用于制造芯片布置的方法，包括在载体上布置芯片，其中芯片的底侧通过芯片底侧上的一个或多个接触焊盘电连接到第一载体侧，在第一封装材料上设置第一封装材料 第一载体侧，其中第一封装材料至少部分地围绕芯片，并且在第二载体侧上设置第二封装材料，其中第二封装材料与第二载体侧直接接触。