Invention Grant
- Patent Title: Integrated circuit packaging system with interposer and method of manufacture thereof
- Patent Title (中): 具有插入器的集成电路封装系统及其制造方法
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Application No.: US13489850Application Date: 2012-06-06
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Publication No.: US09184122B2Publication Date: 2015-11-10
- Inventor: Wei Qiang Jin , Ding Hui Xu
- Applicant: Wei Qiang Jin , Ding Hui Xu
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/10 ; H01L23/50 ; H01L23/31 ; H01L23/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer bottom side and an interposer top side; attaching a base integrated circuit to the interposer bottom side; attaching a lead to the interposer bottom side, the lead adjacent the base integrated circuit and entirely below the interposer; and forming an encapsulation partially covering the lead and exposing the interposer top side.
Public/Granted literature
- US20130328216A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-12-12
Information query
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