Invention Grant
- Patent Title: Semiconductor packages and electronic systems including the same
- Patent Title (中): 半导体封装和电子系统包括相同的
-
Application No.: US14491302Application Date: 2014-09-19
-
Publication No.: US09184156B2Publication Date: 2015-11-10
- Inventor: Hye-Jin Kim , Byung-seo Kim , Sun-Pil Youn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0036731 20090427
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L25/065 ; H01L23/00 ; H01L25/18
Abstract:
A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.
Public/Granted literature
- US20150001737A1 SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME Public/Granted day:2015-01-01
Information query
IPC分类:
