发明授权
- 专利标题： Sealing structure and antenna apparatus
- 专利标题（中）： 密封结构和天线装置
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申请号： US13975906申请日： 2013-08-26
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公开(公告)号： US09186040B2公开(公告)日： 2015-11-17
- 发明人: Shinsuke Tanaka
- 申请人： OLYMPUS MEDICAL SYSTEMS CORP.
- 申请人地址： JP Tokyo
- 专利权人： OLYMPUS CORPORATION
- 当前专利权人： OLYMPUS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Scully, Scott, Murphy & Presser, PC
- 优先权： JP2012-082517 20120330
- 主分类号： A61B1/00
- IPC分类号： A61B1/00 ; H01Q7/02 ; H05K5/03 ; H05K5/00 ; H01L23/31 ; H05K1/18 ; A61B1/04
摘要：
A sealing structure has: a plate portion that is formed with a harder material than a bendable substrate and interposes an electronic device via the substrate from a top surface and a back surface of the substrate on which the electronic device is mounted; and an elastic body that is provided on an outer periphery of the plate portion to cover a part of the plate portion and integrally molded so as to press the plate portion against the substrate.
公开/授权文献
- US20140058196A1 SEALING STRUCTURE AND ANTENNA APPARATUS 公开/授权日：2014-02-27
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