发明授权
US09186828B2 Methods for forming elongated antennas with plastic support structures for electronic devices
有权
用于形成用于电子设备的塑料支撑结构的细长天线的方法
- 专利标题: Methods for forming elongated antennas with plastic support structures for electronic devices
- 专利标题(中): 用于形成用于电子设备的塑料支撑结构的细长天线的方法
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申请号: US13490356申请日: 2012-06-06
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公开(公告)号: US09186828B2公开(公告)日: 2015-11-17
- 发明人: Jerzy Guterman , Jonathan Haylock , Boon W. Shiu , Peter Jeziorek , Erdinc Irci , Jiang Zhu , Mattia Pascolini
- 申请人: Jerzy Guterman , Jonathan Haylock , Boon W. Shiu , Peter Jeziorek , Erdinc Irci , Jiang Zhu , Mattia Pascolini
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 代理机构: Treyz Law Group
- 代理商 G. Victor Treyz; Michael H. Lyons
- 主分类号: H01Q1/24
- IPC分类号: H01Q1/24 ; H01P11/00 ; B29C45/00 ; B29C33/76 ; H01Q1/12 ; H01Q1/22 ; H01Q1/38 ; H01Q7/00 ; B29C45/14 ; B29C45/16
摘要:
Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas.