Invention Grant
- Patent Title: Methods of resizing holes
- Patent Title (中): 调整孔大小的方法
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Application No.: US13669754Application Date: 2012-11-06
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Publication No.: US09187816B2Publication Date: 2015-11-17
- Inventor: Stephen Gerard Pope , Dennis William Cavanaugh , John Gregory Obeirne , Eric Eicher McConnell , Mark Lawrence Hunt , Canan Hardwicke
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agent Ernest G. Cusick; Gary M. Hartman; Domenica N. S. Hartman
- Main IPC: C23C10/20
- IPC: C23C10/20 ; C23C22/58 ; C23C10/18 ; C23C10/28 ; C23C10/60 ; F23R3/28

Abstract:
Methods of reducing an initial cross-sectional area of a hole in a component to a predetermined cross-sectional area including preparing a composition comprising at least an aluminum alloy with a melting temperature higher than aluminum, applying the composition to an interior surface of the hole, and then heating the component to cause a metal within the component to diffuse from the component into the composition and react with the aluminum alloy in the composition to form a coating on the interior surface of the hole. The heating step is performed to selectively modify the initial cross-sectional area of the hole and thereby directly attain the predetermined cross-sectional area thereof.
Public/Granted literature
- US20140124100A1 METHODS OF RESIZING HOLES Public/Granted day:2014-05-08
Information query
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