Invention Grant
- Patent Title: Microarray package device and method of manufacturing the same
- Patent Title (中): 微阵列封装器件及其制造方法
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Application No.: US12938485Application Date: 2010-11-03
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Publication No.: US09187846B2Publication Date: 2015-11-17
- Inventor: Woochang Lee , Jeo-young Shim , Myo-yong Lee , Kak Namkoong , Won-seok Chung
- Applicant: Woochang Lee , Jeo-young Shim , Myo-yong Lee , Kak Namkoong , Won-seok Chung
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2010-0025874 20100323
- Main IPC: B01L3/00
- IPC: B01L3/00 ; C40B60/12
Abstract:
A microarray package device and a method of manufacturing the same. An effective microarray analyzing reaction is performed by using the microarray package device that provides structural stability and reliable experimental results.
Public/Granted literature
- US20110237460A1 MICROARRAY PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-09-29
Information query
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