发明授权
- 专利标题： Element substrate, inspecting method, and manufacturing method of semiconductor device
- 专利标题（中）： 元件基板，检查方法和半导体器件的制造方法
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申请号： US13446614申请日： 2012-04-13
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公开(公告)号： US09188631B2公开(公告)日： 2015-11-17
- 发明人: Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
- 申请人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
- 申请人地址： JP
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Husch Blackwell LLP
- 优先权： JP2005-061717 20050307
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; G01R31/28 ; G01R31/302 ; H01L27/13
摘要：
A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.
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