Invention Grant
US09190100B2 Determining at least one of alignment and bond line thickness between an optical component and a mounting surface
有权
确定光学部件和安装表面之间的对准和粘合线厚度中的至少一个
- Patent Title: Determining at least one of alignment and bond line thickness between an optical component and a mounting surface
- Patent Title (中): 确定光学部件和安装表面之间的对准和粘合线厚度中的至少一个
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Application No.: US13797816Application Date: 2013-03-12
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Publication No.: US09190100B2Publication Date: 2015-11-17
- Inventor: Alok Dhawan , Jon Paul Hurley
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY
- Current Assignee: SEAGATE TECHNOLOGY
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: B32B38/18
- IPC: B32B38/18 ; G11B5/105 ; G11B13/04 ; G11B5/00
Abstract:
A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.
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