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1.发明申请DETERMINING AT LEAST ONE OF ALIGNMENT AND BOND LINE THICKNESS BETWEEN AN OPTICAL COMPONENT AND A MOUNTING SURFACE 有权确定光学元件和安装表面之间的对准和粘合线厚度的至少一个公开(公告)号：US20130288077A1
公开(公告)日：2013-10-31
申请号：US13797816
申请日：2013-03-12
Applicant: SEAGATE TECHNOLOGY LLC
Inventor： Alok Dhawan , Jon Paul Hurley
CPC classification number: G11B13/045 , B32B38/18 , G11B5/105 , G11B2005/0021 , Y10T428/1179
Abstract: A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.
Abstract translation: 光学部件的底面接合到安装表面。 底表面包括第一不透明特征，并且安装表面包括第二不透明特征。 接合后第一和第二不透明特征被隐藏在底表面和安装表面之间。 通过与底面相对的光学部件的顶面获得红外图像。 红外图像包括靠近第一和第二不透明特征的区域的视图。 通过红外图像确定光学部件和安装表面之间的光学对准和粘合线厚度中的一个或多个。
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2.发明授权Determining at least one of alignment and bond line thickness between an optical component and a mounting surface 有权确定光学部件和安装表面之间的对准和粘合线厚度中的至少一个公开(公告)号：US09190100B2
公开(公告)日：2015-11-17
申请号：US13797816
申请日：2013-03-12
Applicant: Seagate Technology LLC
Inventor： Alok Dhawan , Jon Paul Hurley
CPC classification number: G11B13/045 , B32B38/18 , G11B5/105 , G11B2005/0021 , Y10T428/1179
Abstract: A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.
Abstract translation: 光学部件的底面接合到安装表面。 底表面包括第一不透明特征，并且安装表面包括第二不透明特征。 接合后第一和第二不透明特征被隐藏在底表面和安装表面之间。 通过与底面相对的光学部件的顶面获得红外图像。 红外图像包括靠近第一和第二不透明特征的区域的视图。 通过红外图像确定光学部件和安装表面之间的光学对准和粘合线厚度中的一个或多个。
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