Invention Grant
- Patent Title: Dual arm vacuum robot
- Patent Title (中): 双臂真空机器人
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Application No.: US14092240Application Date: 2013-11-27
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Publication No.: US09190306B2Publication Date: 2015-11-17
- Inventor: Richard Blank , Matt McLellan
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; B25J11/00 ; B25J9/04

Abstract:
A dual arm robot for a substrate processing system includes a base and a first arm having extended and retracted positions. Each of the first and second arms includes a first arm portion having one end rotatably connected to the base, a second arm portion having one end rotatably connected to another end of the first arm portion, and an end effector having one end rotatably connected to another end of the second arm portion and another end configured to support first and second substrates, respectively. When the first and second arms are arranged in the retracted position, connections between the second arm portions and the end effectors are located over or under the second and first substrates, respectively, and the first substrate is not located over or under the second substrate.
Public/Granted literature
- US20140154033A1 DUAL ARM VACUUM ROBOT Public/Granted day:2014-06-05
Information query
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