Invention Grant
- Patent Title: Thermoelectric material having reduced thermal conductivity, and thermoelectric device and module including the same
- Patent Title (中): 具有降低的热导率的热电材料，以及包括其的热电装置和模块
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Application No.: US13871246Application Date: 2013-04-26
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Publication No.: US09190594B2Publication Date: 2015-11-17
- Inventor: Sang-il Kim , Kyu-hyoung Lee , Sung-woo Hwang , Kyung-han Ahn
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2012-044666 20120427
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/18 ; H01L35/16 ; C01B19/00
Abstract:
A thermoelectric material including: a thermoelectric matrix including grains with a composition of Formula 1: (BixSb1-x)a(TeySe1-y)b Formula 1 wherein 1.8≦a≦2.2, 2.8≦b≦3.2, 0≦x≦1, and 0≦y≦1, and wherein a plurality of dislocations is present along a grain boundary between adjacent grains of the composition of Formula 1.
Public/Granted literature
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