Various embodiments are directed toward low cost passive waveguide components. For example, various embodiments relate to passive waveguide components created busing a low cost fabrication technology. In some embodiments, a three-dimensional (3D) printing process is used to create a design mold and a non-conductive structure of the waveguide is formed using a plastic injection molding process. A conductive layer may be formed over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.