公开(公告)号：US20240297630A1

公开(公告)日：2024-09-05

申请号：US18584112

申请日：2024-02-22

申请人： The Government of the United States, as represented by the Secretary of the Air Force

发明人： Hengky Chandrahalim ,  David Lynes

IPC分类号： H03H3/007 ,  H03H3/02 ,  H03H9/48

CPC分类号： H03H3/0072 ,  H03H9/48 ,  H03H2003/027

摘要： A method of enhancing an electromechanical coupling coefficient of a microelectromechanical (“MEMS”) device. The method includes applying, to a fully fabricated MEMS device, heavy particle ion radiation to the MEMS device at a fluence of at least 1×1014 cm−2. According to other embodiments of the present invention are directed to a bandpass filter comprising a plurality of MEMS devices fabricated in accordance with the methods provided. The MEMS of the plurality are electronically or mechanically coupled.

公开(公告)号：US20230387877A1

公开(公告)日：2023-11-30

申请号：US18315560

申请日：2023-05-11

申请人： The Government of the United States of America, as represented by the Secretary of the Navy

发明人： Vikrant J. GOKHALE ,  Brian P. DOWNEY ,  Shawn C. MACK ,  D. Scott KATZER ,  David J. MEYER ,  Pallavi DHAGAT ,  Albrecht JANDER

IPC分类号： H03H3/02 ,  H03H3/007

CPC分类号： H03H3/02 ,  H03H3/0077 ,  H03H2003/027

摘要： Method for forming an integrated acoustic device. A thin film piezoelectric acoustic transducer is epitaxially formed on a host substrate and is then transferred to a functional target substrate wherein physical phenomena from the piezoelectric transducer and the arbitrary functional substrate interact to form a hybrid acoustic microsystem comprising the piezoelectric transducer and the arbitrary functional substrate.

公开(公告)号：US20230359019A1

公开(公告)日：2023-11-09

申请号：US18196678

申请日：2023-05-12

申请人： HUAWEI TECHNOLOGIES CO., LTD. ,  FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： Thomas Knieling ,  Ulrich Hofmann ,  Stephan Marauska ,  Berkan Zorlubas ,  Fabian Schwarz ,  Frank Senger ,  Yong Cao

IPC分类号： G02B26/08 ,  H03H3/007 ,  H03H9/10

CPC分类号： G02B26/0858 ,  H03H3/0073 ,  H03H9/1057

摘要： A micromechanical resonator wafer assembly includes an actuator wafer supporting an outer actuator layer. The outer actuator layer includes an oscillating part configured to be driven by an electrical drive signal. The micromechanical resonator wafer assembly further includes a device wafer mounted on top of the actuator wafer. The device wafer includes a plurality of inner actuators. Each of the inner actuators include an oscillation body configured to oscillate about one or more axes. The device wafer is physically connected to the actuator wafer such that each of the inner actuators forms with the outer actuator layer a coupled oscillation system for excitation of the oscillation body of the respective inner actuator. The micromechanical resonator wafer assembly provides external actuation of the oscillation body of each of the inner actuators by use of the outer actuator layer and hence, provides improved scan angles with fast start-up time.

公开(公告)号：US11770112B1

公开(公告)日：2023-09-26

申请号：US17197378

申请日：2021-03-10

申请人： SiTime Corporation

发明人： Charles I. Grosjean ,  Ginel C. Hill ,  Paul M. Hagelin ,  Renata Melamud Berger ,  Aaron Partridge ,  Markus Lutz

IPC分类号： H03H9/24 ,  H03H3/007 ,  B81C1/00 ,  H03H9/10

CPC分类号： H03H9/2457 ,  B81C1/0069 ,  H03H3/0072 ,  H03H3/0076 ,  H03H9/1057

摘要： A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

公开(公告)号：US11699986B2

公开(公告)日：2023-07-11

申请号：US17533340

申请日：2021-11-23

申请人： Seiko Epson Corporation

发明人： Shoichiro Kasahara ,  Shinya Aoki

IPC分类号： H03H9/17 ,  H03H3/007 ,  H03H9/13 ,  H03B5/32

CPC分类号： H03H9/17 ,  H03B5/32 ,  H03H3/007 ,  H03H9/13

摘要： An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

公开(公告)号：US20230208392A1

公开(公告)日：2023-06-29

申请号：US18175954

申请日：2023-02-28

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshiyuki HIGUCHI ,  Masakazu FUKUMITSU

IPC分类号： H03H9/17 ,  H03H3/02 ,  H03H3/007

CPC分类号： H03H9/171 ,  H03H3/02 ,  H03H3/0072

摘要： A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.

公开(公告)号：US11569796B2

公开(公告)日：2023-01-31

申请号：US16627530

申请日：2017-12-05

申请人： KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

发明人： Saad Ilyas ,  Mohammad Ibrahim Younis

IPC分类号： H03H9/46 ,  H03H3/007 ,  H03H9/24 ,  H03H11/04

摘要： A passband filter includes a first and second microelectromechanical resonator system, each including a resonating beam, a drive electrode, and a sense electrode. An AC input signal is coupled to the drive electrode of the first and second microelectromechanical resonator system. A differential-to-single ended amplifier has a first input and second input respectively coupled to the sense electrodes of the first and second microelectromechanical resonator systems. An output of the differential-to-single ended amplifier is an output of the passband filter that provides a bandpass filtered signal of the AC input signal. A DC bias signal is coupled to the resonating beams of the first and second microelectromechanical resonator systems. The first microelectromechanical resonator system exhibits a hardening nonlinear behavior defining an upper stop frequency of the passband and the second microelectromechanical resonator system exhibits a softening nonlinear behavior defining a lower stop frequency of the passband.

公开(公告)号：US11509288B2

公开(公告)日：2022-11-22

申请号：US16839125

申请日：2020-04-03

申请人： Seiko Epson Corporation

发明人： Tetsuya Otsuki ,  Tsugio Ide

IPC分类号： H03H9/05 ,  H03H9/215 ,  H03B5/32 ,  G01C19/56 ,  B81B3/00 ,  H03L1/02 ,  H03H3/007 ,  H03H9/02 ,  H03H9/17 ,  H03H9/19 ,  G01C19/5621 ,  H03H9/10 ,  B81B7/00 ,  H03L1/04

摘要： A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

公开(公告)号：US11469734B1

公开(公告)日：2022-10-11

申请号：US17363386

申请日：2021-06-30

申请人： SiTime Coporation

发明人： Paul M. Hagelin ,  Charles I. Grosjean

IPC分类号： H03B5/30 ,  H03H3/007 ,  H03H9/15 ,  H03H9/02 ,  H03H9/24 ,  H01L41/253 ,  H02N1/00 ,  H03B5/32 ,  H01L41/22 ,  H03H9/21 ,  H03H9/125

摘要： A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

公开(公告)号：US11442492B2

公开(公告)日：2022-09-13

申请号：US16292204

申请日：2019-03-04

申请人： Intel Corporation

发明人： Mohamed A. Abdelmoneum ,  Nasser A. Kurd ,  Thripthi Hegde

IPC分类号： G06F1/08 ,  G06F1/14 ,  G06F9/44 ,  H03H3/007 ,  G06F9/448

摘要： An apparatus and method to protect unauthorized change to a reference clock for a processor. The apparatus comprises: a first oscillator to generate a first clock; a second oscillator to generate a second clock; a third oscillator to generate a third clock; a first counter to count frequency of the first clock with respect to a fourth clock; a second counter to count frequency of the second clock with respect to the fourth clock; a third counter to count frequency of the third clock with respect to the fourth clock; and a circuitry to compare frequencies of the first, second, and third clocks with one another. The oscillators can be embedded in an interposer or package. These oscillators include one or more of: LC oscillator, micro electro-mechanical system (MEMs) based resonator, or ring oscillator.