Invention Grant
- Patent Title: Structural wideband multifunctional aperture manufacturing
- Patent Title (中): 结构宽带多功能孔径制造
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Application No.: US14043563Application Date: 2013-10-01
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Publication No.: US09190727B1Publication Date: 2015-11-17
- Inventor: Manny S. Urcia , Charles W. Manry, Jr. , Joseph A. Marshall, IV , Tai A. Lam , Otis F. Layton
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H01Q1/28
- IPC: H01Q1/28 ; H01Q5/00

Abstract:
A structural wideband aperture assembly and methods are presented. A non-conductive structural backsheet comprises electrical vias. A structural egg-crate core comprises a grid of core strips coupled to the non-conductive structural backsheet and is configured substantially perpendicular to the non-conductive structural backsheet around open boxes. A non-structural grid of antenna feed cards is configured substantially perpendicular to the non-conductive structural backsheet and crosses the core strips. A non-structural grid of antenna feed cards comprises intersections configured within the open boxes, and electronic feed-lines aligned with the electrical vias. Antenna array unit cells comprising antenna cards coupled to the non-structural grid of antenna feed cards and configured to fit within the open boxes.
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