Invention Grant
- Patent Title: PWB cooling system with heat dissipation through posts
- Patent Title (中): PWB散热系统通过柱散热
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Application No.: US13932699Application Date: 2013-07-01
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Publication No.: US09192043B2Publication Date: 2015-11-17
- Inventor: Rachel Farner , Jay W. Kokas , Kenneth J. Trotman , Kerry R. Querns
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Kinney & Lange, P.A.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00
Abstract:
An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.
Public/Granted literature
- US20150000961A1 PWB COOLING SYSTEM WITH HEAT DISSIPATION THROUGH POSTS Public/Granted day:2015-01-01
Information query
