Invention Grant
- Patent Title: Electromagnetic interference shielding structures
- Patent Title (中): 电磁干扰屏蔽结构
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Application No.: US13726890Application Date: 2012-12-26
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Publication No.: US09192057B2Publication Date: 2015-11-17
- Inventor: Shayan Malek , Gregory N. Stephens , Michael B. Wittenberg , Jared M. Kole , Warren Z. Jones
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/30 ; H05K9/00

Abstract:
Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.
Public/Granted literature
- US20140177181A1 Electromagnetic Interference Shielding Structures Public/Granted day:2014-06-26
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