Invention Grant
- Patent Title: Insert assembly for a microfluidic device
- Patent Title (中): 用于微流体装置的插入组件
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Application No.: US13731347Application Date: 2012-12-31
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Publication No.: US09192934B2Publication Date: 2015-11-24
- Inventor: Christian Friedrich Peter Rensch , Victor Donald Samper , Christoph Boeld , Ruben Julian Horvath-Klein
- Applicant: General Electric Company
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Robert M. McCarthy
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B32B37/00 ; B32B37/14 ; G01N1/00 ; G01N27/447 ; G01N30/60

Abstract:
Techniques and devices are provided related to insert assemblies that may be used in conjunction with microfluidic devices. In one embodiment, the insert assemblies include a functional material, such as a solid stationary phase, that may be coupled to a microfluidic pathway via the insert assembly. In this manner, solid stationary phase materials that may be challenging to directly apply to a microfluidic device may be separately enclosed inside the insert element prior to assembly into a microfluidic device, such as a microfluidic chip.
Public/Granted literature
- US20140120010A1 INSERT ASSEMBLY FOR A MICROFLUIDIC DEVICE Public/Granted day:2014-05-01
Information query
IPC分类: