Invention Grant
- Patent Title: Perforated electronic package and method of fabrication
- Patent Title (中): 穿孔电子封装及其制造方法
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Application No.: US14640237Application Date: 2015-03-06
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Publication No.: US09196590B2Publication Date: 2015-11-24
- Inventor: Francis Steffen , Delphine Mathey , Gilbert Assaud , Rémi Brechignac
- Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Rousset) SAS
- Applicant Address: FR Grenoble FR Rousset
- Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Grenoble FR Rousset
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1451979 20140311
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/00 ; H01L23/31 ; H01L23/04 ; H01L23/522 ; H01L21/311 ; H01L21/56
Abstract:
An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
Public/Granted literature
- US20150262941A1 PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION Public/Granted day:2015-09-17
Information query
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