Invention Grant
US09196713B2 Method of manufacturing semiconductor device having oxide semiconductor layer
有权
制造具有氧化物半导体层的半导体器件的方法
- Patent Title: Method of manufacturing semiconductor device having oxide semiconductor layer
- Patent Title (中): 制造具有氧化物半导体层的半导体器件的方法
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Application No.: US14471632Application Date: 2014-08-28
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Publication No.: US09196713B2Publication Date: 2015-11-24
- Inventor: Shunpei Yamazaki , Kengo Akimoto
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2008-224034 20080901
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/66 ; H01L29/49 ; H01L29/786

Abstract:
An object is to provide favorable interface characteristics of a thin film transistor including an oxide semiconductor layer without mixing of an impurity such as moisture. Another object is to provide a semiconductor device including a thin film transistor having excellent electric characteristics and high reliability, and a method by which a semiconductor device can be manufactured with high productivity. A main point is to perform oxygen radical treatment on a surface of a gate insulating layer. Accordingly, there is a peak of the oxygen concentration at an interface between the gate insulating layer and a semiconductor layer, and the oxygen concentration of the gate insulating layer has a concentration gradient. The oxygen concentration is increased toward the interface between the gate insulating layer and the semiconductor layer.
Public/Granted literature
- US20150050774A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2015-02-19
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