Invention Grant
- Patent Title: Semiconductor device and a manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14146036Application Date: 2014-01-02
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Publication No.: US09196748B2Publication Date: 2015-11-24
- Inventor: Kentaro Saito , Hiraku Chakihara
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2013-039615 20130228
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/788 ; H01L29/423 ; H01L29/792 ; H01L27/115

Abstract:
The performances of a semiconductor device are improved. The semiconductor device has a first control gate electrode and a second control gate electrode spaced along the gate length direction, a first cap insulation film formed over the first control gate electrode, and a second cap insulation film formed over the second control gate electrode. Further, the semiconductor device has a first memory gate electrode arranged on the side of the first control gate electrode opposite to the second control gate electrode, and a second memory gate electrode arranged on the side of the second control gate electrode opposite to the first control gate electrode. The end at the top surface of the first cap insulation film on the second control gate electrode side is situated closer to the first memory gate electrode side than the side surface of the first control gate electrode on the second control gate electrode side.
Public/Granted literature
- US20140239367A1 SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF Public/Granted day:2014-08-28
Information query
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