Invention Grant
- Patent Title: Semiconductor device, measurement device, and correction method
- Patent Title (中): 半导体装置,测量装置和校正方法
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Application No.: US13871030Application Date: 2013-04-26
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Publication No.: US09197217B2Publication Date: 2015-11-24
- Inventor: Kazuya Yamada , Toshihisa Sone , Akihiro Takei , Yuichi Yoshida , Kengo Takemasa
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-104075 20120427
- Main IPC: G01R21/00
- IPC: G01R21/00 ; H03L1/02 ; H03L1/04 ; G01R35/04 ; G01R22/10 ; H03K3/011 ; G01R1/44

Abstract:
A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
Public/Granted literature
- US20130285640A1 SEMICONDUCTOR DEVICE, MEASUREMENT DEVICE, AND CORRECTION METHOD Public/Granted day:2013-10-31
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