公开(公告)号：US10411715B2

公开(公告)日：2019-09-10

申请号：US15803707

申请日：2017-11-03

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Kazuya Yamada ,  Toshihisa Sone ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： G01R1/44 ,  H03L1/02 ,  G01R21/00 ,  H03L1/04 ,  G01R35/04 ,  G01R22/10 ,  H03K3/011 ,  G01R22/06 ,  H01L23/495 ,  H01L23/00

摘要： A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

公开(公告)号：US11309234B2

公开(公告)日：2022-04-19

申请号：US16841293

申请日：2020-04-06

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  H01L21/56

摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

公开(公告)号：US10243515B2

公开(公告)日：2019-03-26

申请号：US15691986

申请日：2017-08-31

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Kengo Takemasa ,  Yuichi Yoshida ,  Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L21/56 ,  H03B5/30 ,  H03L1/02 ,  H01L23/31 ,  H01L23/34 ,  H01L23/00

摘要： A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

公开(公告)号：US09257377B2

公开(公告)日：2016-02-09

申请号：US14552510

申请日：2014-11-25

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L25/18 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49596 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H01L2924/3701 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

摘要翻译： 半导体器件包括：振荡器，包括设置在沿第一方向具有特定距离的第一面上的外部端子; 包括沿着一侧形成有第一电极焊盘的第一区域和在所述第一区域的两个相对侧上形成有第二电极焊盘的第二区域的集成电路; 引线框架，其包括在周边部分的端子，并且其上安装有振荡器和集成电路，使得外部端子，第一和第二电极焊盘面向大致相同的方向，并且使得集成电路的一侧为 基本上平行于第一方向; 将一个外部端子连接到一个第一电极焊盘的第一接合线; 将一个引线框架的一个端子连接到一个第二电极焊盘的第二焊接线; 以及密封所有部件的密封构件。

公开(公告)号：US08921987B2

公开(公告)日：2014-12-30

申请号：US13870436

申请日：2013-04-25

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49596 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H01L2924/3701 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

摘要翻译： 半导体器件包括：振荡器，包括设置在沿第一方向具有特定距离的第一面上的外部端子; 包括沿着一侧形成有第一电极焊盘的第一区域和在所述第一区域的两个相对侧上形成有第二电极焊盘的第二区域的集成电路; 引线框架，其包括在周边部分的端子，并且其上安装有振荡器和集成电路，使得外部端子，第一和第二电极焊盘面向大致相同的方向，并且使得集成电路的一侧为 基本上平行于第一方向; 将一个外部端子连接到一个第一电极焊盘的第一接合线; 将一个引线框架的一个端子连接到一个第二电极焊盘的第二焊接线; 以及密封所有部件的密封构件。

公开(公告)号：US09230890B2

公开(公告)日：2016-01-05

申请号：US13870017

申请日：2013-04-25

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Kengo Takemasa ,  Yuichi Yoshida ,  Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei

IPC分类号： H03B5/32 ,  H01L41/08 ,  H01L23/495 ,  H03L1/02 ,  H01L23/34 ,  H01L23/31 ,  H01L21/56

CPC分类号： H03B5/30 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49596 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H03L1/022 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a lead frame, an oscillator, an integrated circuit and first bonding wires. The oscillator includes plural terminals separated from each other by a predetermined distance, and that is mounted to an oscillator mounting region formed on a first face of the lead frame. The oscillator mounting region has a narrower width than the distance between the plural terminals. The integrated circuit is mounted to a second face of the lead frame, which is on an opposite side to the first face. The first bonding wires connect the plural terminals of the oscillator to terminals of the integrated circuit.

摘要翻译： 半导体器件包括引线框架，振荡器，集成电路和第一接合线。 振荡器包括彼此分开预定距离的多个端子，并且安装到形成在引线框架的第一面上的振荡器安装区域。 振荡器安装区域具有比多个端子之间的距离窄的宽度。 集成电路安装在引线框架的与第一面相反的一侧的第二面上。 第一接合线将振荡器的多个端子连接到集成电路的端子。

公开(公告)号：US11854952B2

公开(公告)日：2023-12-26

申请号：US17708955

申请日：2022-03-30

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： H01L23/29 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  H01L21/56

CPC分类号： H01L23/49596 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/49 ,  H01L25/18 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/4917 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H01L2924/3701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/49171 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012

摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

公开(公告)号：US09838022B2

公开(公告)日：2017-12-05

申请号：US15406506

申请日：2017-01-13

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Kazuya Yamada ,  Toshihisa Sone ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： G01R19/32 ,  H03L1/02 ,  H01L23/495 ,  H01L23/00 ,  G01R1/44 ,  G01R22/06 ,  G01R22/10 ,  G01R35/04

CPC分类号： H03L1/026 ,  G01R1/44 ,  G01R21/00 ,  G01R22/061 ,  G01R22/10 ,  G01R35/04 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H03K3/011 ,  H03L1/02 ,  H03L1/027 ,  H03L1/04 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

公开(公告)号：US09787250B2

公开(公告)日：2017-10-10

申请号：US14987084

申请日：2016-01-04

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Kengo Takemasa ,  Yuichi Yoshida ,  Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H03B5/30 ,  H03L1/02 ,  H01L23/31 ,  H01L23/34 ,  H01L23/00 ,  H01L21/56

CPC分类号： H03B5/30 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49596 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H03L1/022 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

公开(公告)号：US09584134B2

公开(公告)日：2017-02-28

申请号：US14926534

申请日：2015-10-29

申请人： LAPIS Semiconductor Co., Ltd.

发明人： Kazuya Yamada ,  Toshihisa Sone ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC分类号： G01R31/3187 ,  H03L1/02 ,  G01R21/00 ,  H03L1/04 ,  G01R35/04 ,  G01R22/10 ,  H03K3/011 ,  G01R22/06 ,  G01R1/44

CPC分类号： H03L1/026 ,  G01R1/44 ,  G01R21/00 ,  G01R22/061 ,  G01R22/10 ,  G01R35/04 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H03K3/011 ,  H03L1/02 ,  H03L1/027 ,  H03L1/04 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

摘要翻译： 半导体器件包括以特定频率振荡的振荡器，集成了检测周围温度的温度传感器的半导体集成电路和与振荡器电连接的控制器，并且校正了振荡频率的温度相关误差 基于由温度传感器检测到的温度的振荡器和一体地密封振荡器和半导体集成电路的密封构件。