Invention Grant
- Patent Title: Automatic hinge locking assembly for electronic device
- Patent Title (中): 用于电子设备的自动铰链锁定组件
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Application No.: US13976151Application Date: 2011-03-31
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Publication No.: US09198312B2Publication Date: 2015-11-24
- Inventor: Ming Zhang , Shanjun Deng , Xiaofeng Sheng
- Applicant: Ming Zhang , Shanjun Deng , Xiaofeng Sheng
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- International Application: PCT/CN2011/000554 WO 20110331
- International Announcement: WO2012/129728 WO 20121004
- Main IPC: E05D3/10
- IPC: E05D3/10 ; H05K5/02 ; G06F1/16 ; H04M1/02

Abstract:
In one embodiment an electronic device comprises a housing having a first section and a second section mounted to the first section by a hinge assembly comprising a base, a swing arm mounted to the base and rotatable about a first axis, and a locking assembly, responsive to a rotation of a shaft coupled to the swing arm, to selectively lock the swing arm to the base. Other embodiments may be described.
Public/Granted literature
- US20140084772A1 AUTOMATIC HINGE LOCKING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2014-03-27
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