Invention Grant
- Patent Title: Diplexer design using through glass via technology
- Patent Title (中): 双工器设计采用玻璃通过技术
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Application No.: US13798733Application Date: 2013-03-13
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Publication No.: US09203373B2Publication Date: 2015-12-01
- Inventor: Chengjie Zuo , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Lan , Daeik D. Kim , Changhan Yun , David F. Berdy , Robert P. Mikulka , Matthew M. Nowak , Xiangdong Zhang , Puay H. See
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Xiaotun Qiu
- Main IPC: H03H7/46
- IPC: H03H7/46 ; H03H3/00 ; H05K1/16 ; H01L23/64 ; H03H1/00 ; H01L23/15 ; H01L23/498 ; H03H7/01 ; H01F17/00 ; H01L23/48 ; H01L23/522 ; H05K1/02 ; H05K1/03 ; H01L23/66
Abstract:
A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.
Public/Granted literature
- US20140197902A1 DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY Public/Granted day:2014-07-17
Information query
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