Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.