公开(公告)号：US20150085195A1

公开(公告)日：2015-03-26

申请号：US14453049

申请日：2014-08-06

Applicant: Silicon Laboratories Inc.

Inventor： Vitor Pereira ,  Ramin Khoini-Poorfard ,  Eric Mauger

IPC: H04N5/455 ,  H04N21/426 ,  H04N9/66

CPC classification number: H04N5/455 ,  H01L25/00 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49113 ,  H01L2225/0651 ,  H04N5/4401 ,  H04N9/66 ,  H04N21/426

Abstract: Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.

Abstract translation: 公开了具有共享一个或多个MCM引脚的具有多个堆叠解调器管芯的MCM（多芯片模块）封装的系统和方法。 共享引脚可以包括时钟产生引脚，时钟输入/输出引脚，接收信号路径输入引脚，电压引脚，接地电源引脚和/或任何其他所需引脚。 除了减少印刷电路板（PCB）应用的印刷尺寸之外，本文所述的多解调器MCM封装实施例还允许改进PCB上连接迹线的布线。

公开(公告)号：US09204080B2

公开(公告)日：2015-12-01

申请号：US14453049

申请日：2014-08-06

Applicant: Silicon Laboratories Inc.

Inventor： Vitor Pereira ,  Ramin Khoini-Poorfard ,  Eric Mauger

IPC: H04N5/455 ,  H04N9/66 ,  H01L25/00

CPC classification number: H04N5/455 ,  H01L25/00 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49113 ,  H01L2225/0651 ,  H04N5/4401 ,  H04N9/66 ,  H04N21/426

Abstract: Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.

Abstract translation: 公开了具有共享一个或多个MCM引脚的具有多个堆叠解调器管芯的MCM（多芯片模块）封装的系统和方法。 共享引脚可以包括时钟产生引脚，时钟输入/输出引脚，接收信号路径输入引脚，电压引脚，接地电源引脚和/或任何其他所需引脚。 除了减少印刷电路板（PCB）应用的印刷尺寸之外，本文所述的多解调器MCM封装实施例还允许改进PCB上连接迹线的布线。