Invention Grant
- Patent Title: Hermetically sealed electronic device using solder bonding
- Patent Title (中): 密封电子器件采用焊接
-
Application No.: US13808571Application Date: 2011-07-22
-
Publication No.: US09205505B2Publication Date: 2015-12-08
- Inventor: Srinivasan Sridharan , Robert P. Blonski , Chandrashekhar Khadilkar , John J. Maloney
- Applicant: Srinivasan Sridharan , Robert P. Blonski , Chandrashekhar Khadilkar , John J. Maloney
- Applicant Address: US OH Mayfield Heights
- Assignee: Ferro Corporation
- Current Assignee: Ferro Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Rankin, Hill & Clark LLP
- International Application: PCT/US2011/045050 WO 20110722
- International Announcement: WO2012/012745 WO 20120126
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/19 ; H01L23/10 ; H01L31/048 ; H01L31/18 ; H05K13/00 ; B23K1/00 ; H01G9/20 ; H01L51/52
Abstract:
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
Public/Granted literature
- US20130206230A1 Hermetically Sealed Electronic Device Using Solder Bonding Public/Granted day:2013-08-15
Information query
IPC分类:
